ISBN
| 9781119381976 |
DDC
| 346.73 |
Tác giả CN
| Rockman, Howard B. |
Nhan đề
| Intellectual property law for engineers, scientists, and entrepreneurs / Howard B Rockman |
Lần xuất bản
| 2nd ed. |
Thông tin xuất bản
| Piscataway, NJ : IEEE Press ; Hoboken, New Jersey : John Wiley & Sons, Inc., 2020 |
Mô tả vật lý
| xxxviii, 934 pages : illustrations ; 27 cm. |
Tóm tắt
| This book informs engineering and science students, technology professionals, and entrepreneurs about the intellectual property laws that are important in their careers. It covers all of the major areas of intellectual property development and protection in non-legalistic terms that are understandable to technology and science professionals. New material includes a comprehensive discussion on the American Invents Act (AIA), coverage of many new high-profile topics, such as patent protection the mobile communications industry, and a new chapter on "The Future of Technology, Engineering, and Intellectual Property." |
Thuật ngữ chủ đề
| Law |
Thuật ngữ chủ đề
| Intellectual property |
Thuật ngữ chủ đề
| Intangible property |
Từ khóa tự do
| United States |
Khoa
| Khoa Công nghệ sinh học |
Địa chỉ
| 300Q12_Kho Mượn_02(1): 083349 |
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245 | |aIntellectual property law for engineers, scientists, and entrepreneurs / |cHoward B Rockman |
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250 | |a2nd ed. |
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260 | |aPiscataway, NJ : IEEE Press ; Hoboken, New Jersey : |bJohn Wiley & Sons, Inc., |c2020 |
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300 | |axxxviii, 934 pages : |billustrations ; |c27 cm. |
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520 | |aThis book informs engineering and science students, technology professionals, and entrepreneurs about the intellectual property laws that are important in their careers. It covers all of the major areas of intellectual property development and protection in non-legalistic terms that are understandable to technology and science professionals. New material includes a comprehensive discussion on the American Invents Act (AIA), coverage of many new high-profile topics, such as patent protection the mobile communications industry, and a new chapter on "The Future of Technology, Engineering, and Intellectual Property." |
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346.73 R683
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